Vacancy expired!
Description: About GLOBALFOUNDRIES\: GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Summary of Role\: GLOBALFOUNDRIES Fab 10 is seeking a highly motivated & versatile Unit Process Engineer in Hopewell Junction, New York. The main responsibility of this position is to develop leading edge & novel wafer level packaging processes working with state-of-the art tooling platforms as well as drive associated materials development. The scope of activities covers= developing material, process and tooling refinements by working closely with the larger technical GLOBALFOUNDRIES team and with external vendors to advance the state-of-the-art of the packaging technology. Essential Responsibilities include\:
- Process development concentrating on electroplating advancements for wafer level packaging technology by working with the key technical experts within GLOBALFOUNDRIES Advanced Si Packaging Development team.
- Develop deep expertise in the electroplating process, materials and tooling leveraging available characterization resources. Drive mechanistic understanding of failure modes
- Drive process schemes to continuously improve yields and to reduce cycle-time & costs.
- Influence technology design rules to ensure high yielding process by collaborating with the Design Enablement teams and Business Units.
- Ensure robust interconnect performance by conceiving and executing qualification plans working closely with the Reliability and Quality Assurance teams.
- Execute interconnect roadmap strategy by pathfinding new materials and processes to enable next-gen structures. Generate IP related to novel interconnect structures and process techniques.
- Support program plans to enable early product prototyping and qualification by timely execution of sector WIP.
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
- Education - MSc Chemical Engineering or Material Science
- Experience - 5yrs minimum of demonstrated electroplating experience
- Travel - 10%
- Fluent in English
- PhD in Material Science or Engineering
- Experience in electroplating materials development
- Experience with semiconductor plating equipment platforms
Vacancy expired!