Job Details

ID #2647432
State Texas
City Dallas / fort worth
Full-time
Salary USD TBD TBD
Source Texas Instruments
Showed 2019-08-22
Date 2019-08-22
Deadline 2019-10-21
Category Et cetera
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Packaging Engineering Intern

Texas, Dallas / fort worth 00000 Dallas / fort worth USA

Vacancy expired!

DescriptionAbout TITexas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!About the jobInterface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.Put your talent to work with us as a Packaging Engineering Intern – change the world, love your job!QualificationsMinimum Requirements:

Currently pursuing an MS degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering.

Minimum Cumulative 3.0 GPA

Preferred Qualifications:

Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)

Demonstrated analytical and problem solving skills

Strong written and verbal communication skills

Ability to work in teams and collaborate effectively with people in different functions

Strong time management skills that enable on-time project delivery

Ability to build strong, influential relationships

Ability to work effectively in a fast-paced and rapidly changing environment

Ability to take the initiative and drive for results

If you are interested in this position, please apply to this requisition.Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to protected characteristics, including race, color, religion, sex, national origin, disability, veteran status, sexual orientation, gender identity or age.Status RegularJob: Engineering - Product DevPrimary Location: US-TX-DallasWork Locations: Dallas > Dallas Support Bldg, Floyd Rd. DallasReq ID: 1900030C

Vacancy expired!

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