Vacancy expired!
We have an immediate opportunity for Reliability Lab Technician in Redmond, WA. The ideal candidate must have experience in automated deposition adhesive, bonding tools (Semi-conductor), bonders (Semi-conductor) [examples: Semiconductor wire and wedge bonders include tools for die bonding and wire bonding]. Used to attaching and interconnecting a semiconductor die or IC chip to a package or substrate. Must be good in Die bonding tools including bonding capillaries, bonding wedges, EFO wands, die attach collets, die shear tools, ejector pins or push up needles, flip chip tools, spanking tools, push-up needles (pepper pots) and tab tools (micro BGA, waffle) etc. Must have worked on kinetic propellants, pick and place machine / chip shooters / Flexible place / Overhead gantry. Experience in experience in handling vacuum nozzles, mechanical gripper, stick feeders, direct die feeder etc. is required. Must have good experience in Generic reliability test (Thermal/stress), Micro component placements, Clean room related automated instruments exposure / experience and MES exposure. The ideal candidate should have experience in Adhesive, MES exposure, Generic reliability test (Thermal/stress), Design of Experiments (DOE) and Die bonding tools. ALL successful candidates for this position are required to work directly for PRIMUS For immediate consideration, please apply directly to Dice.com using the "Easy Apply" link noted below. Raj PRIMUS Global Services
Vacancy expired!