Vacancy expired!
In this position the individual will assume responsibility in the area of semiconductor process engineering. The candidate will take responsibility on working directly on new process modules, including materials research, and developing new process integrations schemes for 3D NAND memory technology.ESSENTIAL DUTIES AND RESPONSIBILITIES:Primary job function will focus on utilizing processing techniques such as Reactive Ion Etching (RIE), Chemical Dry Etching (CDE), Atomic Layer Etching (ALE), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD/), Rapid Thermal Processing (RTP) and Oxidation to fabricate semiconductor memory devices.Process development will also include Research & Development on unique processes and materials. Collecting structural analysis such as SEMs/TEMs and analyzing many forms of process data from experimental splits using statistical analysis software and conducting process optimization using design of experiments (DOE) will be required. Interfacing with several engineering departments, including design, integration, and device will occur on a regular basis. Process development will be conducted through local fabs, vendors, and our fabrications facilities in Japan. Short-to-mid stay travel may be needed to our fabs in Yokkaichi, Japan. Responsibility will also include selection of new process equipment used in all areas of wafer fabrication. 
Vacancy expired!