Job Details

ID #51368649
State New York
City Newyorkstate
Full-time
Salary USD TBD TBD
Source FuzeHub
Showed 2024-03-31
Date 2024-03-27
Deadline 2024-05-26
Category Architect/engineer/CAD
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Semiconductor Packaging Engineer

New York, Newyorkstate 00000 Newyorkstate USA

Vacancy expired!

diverse team supporting photonics and electronic integrated circuit technologies.

The position is for a back-end process / packaging engineer to join our packaging process engineering team to support manufacturing and development of semiconductor-based optics/

Vacancy expired!

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